Frattura ed Integrità Strutturale - v. 5, n. 15 (January 2011)
Published: | January 2011 |
---|
Articles in this Issue
Author(s) | Title | Page(s) |
---|---|---|
Vogel, K. / Wuensch, D. / Shaporin, A. / Mehner, J. / Billep, D. / Wiemer, M. | Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers | 21-28 |
Fuchs, P. F. / Major, Z. | Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads | 64-73 |
Zuliani, N. | Design and experimental characterization of a 350 W High Temperature PEM fuel cell stack | 29-34 |
Berto, F. / Marangon, C. | Esistenza del modo O in piastre tridimensionali con fori circolari ed ellittici soggette a modo II | 14-20 |
Kytyr, D. / Doktor, T. / Jirousek, O. / Zlamal, P. / Pokorny, D. | Experimental and numerical study of cemented bone-implant interface behavior | 5-13 |
Raju, I. S. / Knight, N. F. / Song, K. / Phillips, D. R. | Fracture mechanics analyses of the slip-side joggle regions of wing-leading-edge panels | 35-49 |
Moroni, F. | Studio delle prestazioni di giunzioni incollate ibride (Strength evaluation of structural hybrid bonded joints) | 50-63 |