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Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads

Author(s):

Medium: journal article
Language(s): English
Published in: Frattura ed Integrità Strutturale, , n. 15, v. 5
Page(s): 64-73
DOI: 10.3221/igf-esis.15.07
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.3221/igf-esis.15.07.
  • About this
    data sheet
  • Reference-ID
    10458673
  • Published on:
    25/10/2020
  • Last updated on:
    25/10/2020
 
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