Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers
| Author(s): |
K. Vogel
D. Wuensch A. Shaporin J. Mehner D. Billep M. Wiemer |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Frattura ed Integrità Strutturale, January 2011, n. 15, v. 5 |
| Page(s): | 21-28 |
| DOI: | 10.3221/igf-esis.15.03 |
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10458677 - Published on:
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25/10/2020
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