Frattura ed Integrità Strutturale - v. 5, n. 15 (janvier 2011)
| Publié: | janvier 2011 |
|---|
Articles dans ce numéro
| Auteur(s) | Titre | Page(s) |
|---|---|---|
| Vogel, K. / Wuensch, D. / Shaporin, A. / Mehner, J. / Billep, D. / Wiemer, M. | Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers | 21-28 |
| Fuchs, P. F. / Major, Z. | Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads | 64-73 |
| Zuliani, N. | Design and experimental characterization of a 350 W High Temperature PEM fuel cell stack | 29-34 |
| Berto, F. / Marangon, C. | Esistenza del modo O in piastre tridimensionali con fori circolari ed ellittici soggette a modo II | 14-20 |
| Kytyr, D. / Doktor, T. / Jirousek, O. / Zlamal, P. / Pokorny, D. | Experimental and numerical study of cemented bone-implant interface behavior | 5-13 |
| Raju, I. S. / Knight, N. F. / Song, K. / Phillips, D. R. | Fracture mechanics analyses of the slip-side joggle regions of wing-leading-edge panels | 35-49 |
| Moroni, F. | Studio delle prestazioni di giunzioni incollate ibride (Strength evaluation of structural hybrid bonded joints) | 50-63 |
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25.10.2020 - Modifié(e) le:
25.10.2020
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