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Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging

Author(s):

Medium: journal article
Language(s): English
Published in: Computers & Structures, , n. 2, v. 74
Page(s): 215-231
DOI: 10.1016/s0045-7949(99)00028-0
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/s0045-7949(99)00028-0.
  • About this
    data sheet
  • Reference-ID
    10280363
  • Published on:
    05/01/2019
  • Last updated on:
    05/01/2019
 
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