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Rumpa Chandaroy

The following bibliography contains all publications indexed in this database that are linked with this name as either author, editor or any other kind of contributor.

  1. Basaran, Cemal / Chandaroy, Rumpa (2000): Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging. In: Computers & Structures, v. 74, n. 2 (January 2000).

    https://doi.org/10.1016/s0045-7949(99)00028-0

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