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The following bibliography contains all publications indexed in this database that are linked with this name as either author, editor or any other kind of contributor.

  1. Basaran, Cemal / Chandaroy, Rumpa (2000): Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging. In: Computers & Structures, v. 74, n. 2 (January 2000).

    https://doi.org/10.1016/s0045-7949(99)00028-0

  2. Kim, Dongkeon / Dargush, Gary F. / Basaran, Cemal (2013): A cyclic two-surface thermoplastic damage model with application to metallic plate dampers. In: Engineering Structures, v. 52 (July 2013).

    https://doi.org/10.1016/j.engstruct.2013.02.030

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