Cemal Basaran
- Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging. Dans: Computers & Structures, v. 74, n. 2 (janvier 2000). (2000):
- A cyclic two-surface thermoplastic damage model with application to metallic plate dampers. Dans: Engineering Structures, v. 52 (juillet 2013). (2013):