Thermal Management Materials for Advanced Heat Sinks used in Modern Microelectronics
| Author(s): |
S. V. Jadhav
P. M. Pawar S. S. Wangikar N. N. Bhostekar S. T. Pawar |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | IOP Conference Series: Materials Science and Engineering, June 2020, v. 814 |
| Conference: | International Conference on Sustainable Innovations in Civil & Mechanical Engineering, 02-04 January 2020, Pandharpur, Maharashtra, India |
| Page(s): | 012044 |
| DOI: | 10.1088/1757-899X/814/1/012044 |
| Copyright: | © 2020 S V Jadhav, P M Pawar, S S Wangikar, N N Bhostekar, S T Pawar |
| License: | This creative work has been published under the Creative Commons Attribution 3.0 Unported (CC-BY 3.0) license which allows copying, and redistribution as well as adaptation of the original work provided appropriate credit is given to the original author and the conditions of the license are met. |
Download full text file (PDF)
0.79 MB
Advertisement
Advertisement
0.79 MB
- About this
data sheet - Reference-ID
10433047 - Published on:
25/08/2020 - Last updated on:
14/09/2021
Structurae cooperates with