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Phase field simulation of the inclusion instability and splitting processes in interconnects due to interface diffusion induced by electromigration

Author(s):


Medium: journal article
Language(s): English
Published in: Journal of Mechanics of Materials and Structures, , n. 1, v. 18
Page(s): 39-58
DOI: 10.2140/jomms.2023.18.39
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.2140/jomms.2023.18.39.
  • About this
    data sheet
  • Reference-ID
    10729152
  • Published on:
    30/05/2023
  • Last updated on:
    30/05/2023
 
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