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Novel test prototype for the determination of mode I fracture parameters: application to adhesively bonded electronics

Author(s):



Medium: journal article
Language(s): English
Published in: Procedia Structural Integrity, , v. 5
Page(s): 5-12
DOI: 10.1016/j.prostr.2017.07.051
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.prostr.2017.07.051.
  • About this
    data sheet
  • Reference-ID
    10642356
  • Published on:
    10/01/2022
  • Last updated on:
    10/01/2022
 
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