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Mechanical, dielectric and thermal properties of polyimide films with sandwich structure

Author(s):





Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 261
Page(s): 113305
DOI: 10.1016/j.compstruct.2020.113305
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2020.113305.
  • About this
    data sheet
  • Reference-ID
    10578845
  • Published on:
    02/03/2021
  • Last updated on:
    02/03/2021
 
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