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In situ assembly enabling adhesive-free bonding of large area electronic sensors to concrete for structural health monitoring

Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1088/1361-665x/ad7d56.
  • About this
    data sheet
  • Reference-ID
    10798886
  • Published on:
    23/09/2024
  • Last updated on:
    23/09/2024
 
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