In situ assembly enabling adhesive-free bonding of large area electronic sensors to concrete for structural health monitoring
| Author(s): |
Emmanuel Ogunniyi
Han Liu
Austin Downey
Simon Laflamme
Jian Li
Caroline R. Bennett
William Collins Hongki Jo Paul Ziehl |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Smart Materials and Structures, 18 September 2024, n. 10, v. 33 |
| Page(s): | 105047 |
| DOI: | 10.1088/1361-665x/ad7d56 |
- About this
data sheet - Reference-ID
10798886 - Published on:
23/09/2024 - Last updated on:
10/11/2024
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