Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints
| Author(s): |
Hsiao-Yun Chen
Min-Feng Ku Chih Chen |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Advances in Materials Research, March 2012, n. 1, v. 1 |
| Page(s): | 83-92 |
| DOI: | 10.12989/amr.2012.1.1.083 |
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10666904 - Published on:
27/05/2022 - Last updated on:
27/05/2022
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