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Hsiao-Yun Chen

The following bibliography contains all publications indexed in this database that are linked with this name as either author, editor or any other kind of contributor.

  1. Chen, Hsiao-Yun / Ku, Min-Feng / Chen, Chih (2012): Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints. In: Advances in Materials Research, v. 1, n. 1 (March 2012).

    https://doi.org/10.12989/amr.2012.1.1.083

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