Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion in a gradient stress field and an electric field
| Author(s): |
Linyong Zhou
Peizhen Huang Qiang Cheng |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Journal of Mechanics of Materials and Structures, August 2018, n. 3, v. 13 |
| Page(s): | 365-378 |
| DOI: | 10.2140/jomms.2018.13.365 |
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10548079 - Published on:
20/01/2021 - Last updated on:
19/02/2021
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