Peizhen Huang
- (2024): Phase-field simulation of conductive inclusion evolution in highly symmetric oriented single crystal metal interconnects under anisotropic interface diffusion induced by electromigration. Dans: Journal of Mechanics of Materials and Structures, v. 19, n. 3 (27 mars 2024).
- (2023): Phase field simulation of the inclusion instability and splitting processes in interconnects due to interface diffusion induced by electromigration. Dans: Journal of Mechanics of Materials and Structures, v. 18, n. 1 (24 mars 2023).
- (2021): The evolution of intragranular microcracks caused by interface migration induced by electromigration. Dans: Journal of Mechanics of Materials and Structures, v. 16, n. 4 (9 novembre 2021).
- (2018): Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion in a gradient stress field and an electric field. Dans: Journal of Mechanics of Materials and Structures, v. 13, n. 3 (août 2018).
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