Peizhen Huang
- Phase-field simulation of conductive inclusion evolution in highly symmetric oriented single crystal metal interconnects under anisotropic interface diffusion induced by electromigration. In: Journal of Mechanics of Materials and Structures, v. 19, n. 3 (27 März 2024). (2024):
- Phase field simulation of the inclusion instability and splitting processes in interconnects due to interface diffusion induced by electromigration. In: Journal of Mechanics of Materials and Structures, v. 18, n. 1 (24 März 2023). (2023):
- The evolution of intragranular microcracks caused by interface migration induced by electromigration. In: Journal of Mechanics of Materials and Structures, v. 16, n. 4 (9 November 2021). (2021):
- Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion in a gradient stress field and an electric field. In: Journal of Mechanics of Materials and Structures, v. 13, n. 3 (August 2018). (2018):