The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymer
| Author(s): |
Pawel Malinowski
Tomasz Wandowski Wieslaw Ostachowicz |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Structural Health Monitoring, April 2015, n. 4, v. 14 |
| Page(s): | 332-344 |
| DOI: | 10.1177/1475921715586625 |
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10561916 - Published on:
11/02/2021 - Last updated on:
19/02/2021
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