Transient multi-F ick ian hygro-mechanical analysis of wood
Author(s): |
Daniel Konopka
Michael Kaliske |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Computers & Structures, February 2018, v. 197 |
Page(s): | 12-27 |
DOI: | 10.1016/j.compstruc.2017.11.012 |
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10285450 - Published on:
05/01/2019 - Last updated on:
05/01/2019