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Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM

Author(s):

Medium: journal article
Language(s): English
Published in: Energy and Buildings, , v. 73
Page(s): 37-47
DOI: 10.1016/j.enbuild.2014.01.017
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.enbuild.2014.01.017.
  • About this
    data sheet
  • Reference-ID
    10467538
  • Published on:
    27/10/2020
  • Last updated on:
    27/10/2020
 
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