Thermal design of a sensor for building control equipped with QFN electronic devices subjected to free convection. Effects of the encapsulating resin
| Author(s): |
A. Baïri
N. Nithyadevi I. Baïri A. Martín-Garín J. A. Millán-García |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Energy and Buildings, April 2017, v. 141 |
| Page(s): | 218-225 |
| DOI: | 10.1016/j.enbuild.2017.02.022 |
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10470202 - Published on:
27/10/2020 - Last updated on:
27/10/2020
Structurae cooperates with
