Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines
| Author(s): |
Quanyi Mu
Conner K. Dunn Lei Wang Martin L. Dunn H. Jerry Qi Tiejun Wang |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Smart Materials and Structures, April 2017, n. 4, v. 26 |
| Page(s): | 045008 |
| DOI: | 10.1088/1361-665x/aa5cca |
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10215717 - Published on:
04/12/2018 - Last updated on:
04/12/2018
Structurae cooperates with
