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Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines

Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1088/1361-665x/aa5cca.
  • About this
    data sheet
  • Reference-ID
    10215717
  • Published on:
    04/12/2018
  • Last updated on:
    04/12/2018
 
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