0
  • DE
  • EN
  • FR
  • International Database and Gallery of Structures

Advertisement

Quanyi Mu

The following bibliography contains all publications indexed in this database that are linked with this name as either author, editor or any other kind of contributor.

  1. Mu, Quanyi / Dunn, Conner K. / Wang, Lei / Dunn, Martin L. / Qi, H. Jerry / Wang, Tiejun (2017): Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines. In: Smart Materials and Structures, v. 26, n. 4 (April 2017).

    https://doi.org/10.1088/1361-665x/aa5cca

  2. Mu, Quanyi / Lei, Ming / Roach, Devin J. / Dunn, Conner K. / Kuang, Xiao / Yuan, Chao / Wang, Tiejun / Qi, H. Jerry (2018): Intense pulsed light sintering of thick conductive wires on elastomeric dark substrate for hybrid 3D printing applications. In: Smart Materials and Structures, v. 27, n. 11 (November 2018).

    https://doi.org/10.1088/1361-665x/aae11f

Search for a publication...

Only available with
My Structurae

Full text
Structurae cooperates with
International Association for Bridge and Structural Engineering (IABSE)
e-mosty Magazine
e-BrIM Magazine