Tensile fracture of integrated single-crystal silicon nanowire using MEMS electrostatic testing device
| Author(s): |
Toshiyuki Tsuchiya
Tetsuya Hemmi Jun-ya Suzuki Yoshikazu Hirai Osamu Tabata |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Procedia Structural Integrity, 2016, v. 2 |
| Page(s): | 1405-1412 |
| DOI: | 10.1016/j.prostr.2016.06.178 |
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10641649 - Published on:
17/02/2022 - Last updated on:
17/02/2022
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