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Temperature-dependent debonding behavior of adhesively bonded CFRP-UHPC interface

Author(s): ORCID


ORCID

Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 340
Page(s): 118200
DOI: 10.1016/j.compstruct.2024.118200
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2024.118200.
  • About this
    data sheet
  • Reference-ID
    10788881
  • Published on:
    20/06/2024
  • Last updated on:
    20/06/2024
 
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