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Study on the rheological properties and polishing properties of SiO2@CI composite particle for sapphire wafer

Author(s):


Medium: journal article
Language(s): English
Published in: Smart Materials and Structures, , n. 11, v. 29
Page(s): 114003
DOI: 10.1088/1361-665x/abb21c
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1088/1361-665x/abb21c.
  • About this
    data sheet
  • Reference-ID
    10434618
  • Published on:
    11/09/2020
  • Last updated on:
    30/09/2020
 
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