Smart polyimide with recovery stress at the level of high temperature shape memory alloys
| Author(s): |
Kong Deyan
Jie Li Anru Guo Jianxin Yu Xinli Xiao |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Smart Materials and Structures, February 2021, n. 3, v. 30 |
| Page(s): | 035027 |
| DOI: | 10.1088/1361-665x/abe182 |
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10560309 - Published on:
03/02/2021 - Last updated on:
19/02/2021
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