Sensitivity of piezoelectric wafers to the curing of thermoset resins and thermoset composites
| Author(s): |
Xiaoming Wang
Claus Ehlers Christian Kissinger Manfred Neitzel Lin Ye Yiu-Wing Mai |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Smart Materials and Structures, February 1998, n. 1, v. 7 |
| Page(s): | 113-120 |
| DOI: | 10.1088/0964-1726/7/1/013 |
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10214681 - Published on:
04/12/2018 - Last updated on:
04/12/2018
Structurae cooperates with
