Room temperature creep mechanism of a Pb-Sn-Sb lead alloy
Author(s): |
Luigi Mario Viespoli
Audun Johanson Antonio Alvaro Bård Nyhus Filippo Berto |
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Medium: | journal article |
Language(s): | English |
Published in: | Procedia Structural Integrity, 2019, v. 18 |
Page(s): | 86-92 |
DOI: | 10.1016/j.prostr.2019.08.142 |
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10644973 - Published on:
10/01/2022 - Last updated on:
10/01/2022