Processing mechanics for flip-chip assemblies
| Author(s): |
J. Wang
W. Ren D. Zou Z. Qian S. Liu |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Computers & Structures, May 1999, n. 4, v. 71 |
| Page(s): | 457-468 |
| DOI: | 10.1016/s0045-7949(98)00202-8 |
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05/01/2019
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