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Phase-field simulation of conductive inclusion evolution in highly symmetric oriented single crystal metal interconnects under anisotropic interface diffusion induced by electromigration

Author(s):

Medium: journal article
Language(s): English
Published in: Journal of Mechanics of Materials and Structures, , n. 3, v. 19
Page(s): 373-395
DOI: 10.2140/jomms.2024.19.373
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.2140/jomms.2024.19.373.
  • About this
    data sheet
  • Reference-ID
    10774653
  • Published on:
    29/04/2024
  • Last updated on:
    29/04/2024
 
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