Phase-field simulation of conductive inclusion evolution in highly symmetric oriented single crystal metal interconnects under anisotropic interface diffusion induced by electromigration
| Author(s): |
Congcong Dong
Peizhen Huang |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Journal of Mechanics of Materials and Structures, 27 March 2024, n. 3, v. 19 |
| Page(s): | 373-395 |
| DOI: | 10.2140/jomms.2024.19.373 |
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10774653 - Published on:
29/04/2024 - Last updated on:
29/04/2024
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