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Optimization of convective heat transfer in micro-scale electronics cooling applications

Author(s): (Dep. of MechanicalEngineering, K.U.Leuven, Celestijnenlaan 300 A, 3001 Heverlee, Belgium)
(Dep. of MechanicalEngineering, K.U.Leuven, Celestijnenlaan 300 A, 3001 Heverlee, Belgium)
(Purdue University,School of Mechanical Engineering, 585 Purdue Mall, West Lafayette, IN, USA)
(Dep. of MechanicalEngineering, K.U.Leuven, Celestijnenlaan 300 A, 3001 Heverlee, Belgium)
(Dep. of MechanicalEngineering, K.U.Leuven, Celestijnenlaan 300 A, 3001 Heverlee, Belgium)
(Dep. of MechanicalEngineering, K.U.Leuven, Celestijnenlaan 300 A, 3001 Heverlee, Belgium)
Medium: journal article
Language(s): English
Published in: La Houille Blanche, , n. 4, v. 97
Page(s): 70-78
DOI: 10.1051/lhb/2011043
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1051/lhb/2011043.
  • About this
    data sheet
  • Reference-ID
    10655074
  • Published on:
    17/02/2022
  • Last updated on:
    17/02/2022
 
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