Optimisation of location and dimension of SMC precharge in compression moulding process
Author(s): |
Moo-Sun Kim
Woo Il Lee Woo-Suck Han Alain Vautrin |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Computers & Structures, August 2011, n. 15-16, v. 89 |
Page(s): | 1523-1534 |
DOI: | 10.1016/j.compstruc.2011.04.004 |
- About this
data sheet - Reference-ID
10282960 - Published on:
05/01/2019 - Last updated on:
05/01/2019