On thermomechanical stress analysis of adhesively bonded composite joints in presence of an interfacial void
Author(s): |
M. Tahani
S. A. Yousefsani |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Composite Structures, October 2015, v. 130 |
Page(s): | 116-123 |
DOI: | 10.1016/j.compstruct.2015.04.036 |
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10453768 - Published on:
23/10/2020 - Last updated on:
23/10/2020