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On thermomechanical stress analysis of adhesively bonded composite joints in presence of an interfacial void

Author(s):

Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 130
Page(s): 116-123
DOI: 10.1016/j.compstruct.2015.04.036
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2015.04.036.
  • About this
    data sheet
  • Reference-ID
    10453768
  • Published on:
    23/10/2020
  • Last updated on:
    23/10/2020
 
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