Numerical modeling for viscoelastic sandwich smart structures bonded with piezoelectric materials
Author(s): |
S. Q. Zhang
Y. S. Gao G. Z. Zhao H. Y. Pu M. Wang J. H. Ding Y. Sun |
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Medium: | journal article |
Language(s): | English |
Published in: | Composite Structures, December 2021, v. 278 |
Page(s): | 114703 |
DOI: | 10.1016/j.compstruct.2021.114703 |
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10631584 - Published on:
01/10/2021 - Last updated on:
01/10/2021