Numerical analysis of edge effects in adhesively-bonded assemblies application to the determination of the adhesive behaviour
Author(s): |
Jean Yves Cognard
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Medium: | journal article |
Language(s): | English |
Published in: | Computers & Structures, September 2008, n. 17-18, v. 86 |
Page(s): | 1704-1717 |
DOI: | 10.1016/j.compstruc.2008.02.003 |
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10274482 - Published on:
05/01/2019 - Last updated on:
05/01/2019