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A new approach to compute heat transfer of ground-coupled envelope in building thermal simulation software

Author(s):


Medium: journal article
Language(s): English
Published in: Energy and Buildings, , n. 4, v. 40
Page(s): 476-485
DOI: 10.1016/j.enbuild.2007.04.007
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.enbuild.2007.04.007.
  • About this
    data sheet
  • Reference-ID
    10465157
  • Published on:
    27/10/2020
  • Last updated on:
    27/10/2020
 
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