Multi-scale characterization of SAP impact on self-healing behavior in UHPC under varied crack widths and environments
Author(s): |
Zaixin Yang
Chengxiang Miao Wenqin Deng Duo Liu Jiandong Zhang Jiancheng Gu |
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Medium: | journal article |
Language(s): | English |
Published in: | Construction and Building Materials, March 2024, v. 421 |
Page(s): | 135649 |
DOI: | 10.1016/j.conbuildmat.2024.135649 |
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10771689 - Published on:
29/04/2024 - Last updated on:
29/04/2024