Modeling the postbuckling behavior of thermal-resistant ultrathin films attached to glass substrate
Author(s): |
Yang Zhang
Gen Li David Hui K. M. Liew |
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Medium: | journal article |
Language(s): | English |
Published in: | Composite Structures, December 2018, v. 206 |
Page(s): | 279-287 |
DOI: | 10.1016/j.compstruct.2018.08.044 |
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10449954 - Published on:
23/10/2020 - Last updated on:
23/10/2020