Microstructural Modeling for Elastic Moduli of Bonded Granules
Author(s): |
Ching S. Chang
Qing S. Shi Han Zhu |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Journal of Engineering Mechanics (ASCE), June 1999, n. 6, v. 125 |
Page(s): | 648-653 |
DOI: | 10.1061/(asce)0733-9399(1999)125:6(648) |
- About this
data sheet - Reference-ID
10349309 - Published on:
14/08/2019 - Last updated on:
14/08/2019