Micromechanical model for describing intergranular fatigue cracking in a lead-free solder alloy
Author(s): |
V. N. Le
L. Benabou V. Etgens Q. B. Tao |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Procedia Structural Integrity, 2016, v. 2 |
Page(s): | 2614-2622 |
DOI: | 10.1016/j.prostr.2016.06.327 |
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10641945 - Published on:
17/02/2022 - Last updated on:
17/02/2022