Mechanically-compensated bending-strain measurement of multilayered paper-like electronics via surface-mounted sensor
| Author(s): |
Furong Chen
Chao Hou Shan Jiang Chen Zhu Lin Xiao Hong Ling Jing Bian Dong Ye Yongan Huang |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Composite Structures, December 2021, v. 277 |
| Page(s): | 114652 |
| DOI: | 10.1016/j.compstruct.2021.114652 |
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10631650 - Published on:
01/10/2021 - Last updated on:
01/10/2021
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