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Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles

Author(s):




Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 347
Page(s): 118462
DOI: 10.1016/j.compstruct.2024.118462
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2024.118462.
  • About this
    data sheet
  • Reference-ID
    10796931
  • Published on:
    01/09/2024
  • Last updated on:
    01/09/2024
 
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