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Investigation on a new semiconductor cooling garment for reducing heat stress of outdoor workers performing moderate activities in a hot and humid environment

Author(s):





Medium: journal article
Language(s): English
Published in: Energy and Buildings, , v. 312
Page(s): 114174
DOI: 10.1016/j.enbuild.2024.114174
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.enbuild.2024.114174.
  • About this
    data sheet
  • Reference-ID
    10774292
  • Published on:
    26/04/2024
  • Last updated on:
    26/04/2024
 
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