Investigation on a new semiconductor cooling garment for reducing heat stress of outdoor workers performing moderate activities in a hot and humid environment
Auteur(s): |
Song Wenfang
Xie Xinze Liang Yaqi Lu Xinyan Ye Ying Tong Youjun |
---|---|
Médium: | article de revue |
Langue(s): | anglais |
Publié dans: | Energy and Buildings, juin 2024, v. 312 |
Page(s): | 114174 |
DOI: | 10.1016/j.enbuild.2024.114174 |
- Informations
sur cette fiche - Reference-ID
10774292 - Publié(e) le:
26.04.2024 - Modifié(e) le:
26.04.2024