Investigating the effect of binder and aggregate application rates on performance of chip seals via digital image processing and sweep tests
| Author(s): |
Yogesh Shamsunder Kumbargeri
Ilker Boz M. Emin Kutay |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Construction and Building Materials, October 2019, v. 222 |
| Page(s): | 213-221 |
| DOI: | 10.1016/j.conbuildmat.2019.06.089 |
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data sheet - Reference-ID
10314930 - Published on:
24/06/2019 - Last updated on:
24/06/2019
Structurae cooperates with
