Highly thermally conductive BNNS/PANF dielectric composite boards prepared by a facile compression moulding process
| Author(s): |
Shen Zhao
Zhixiong Wu Yemao Han Di Jiang Yue Xiang Zhen Geng Laifeng Li Chunjie Xie Zhicong Miao Rongjin Huang |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Composite Structures, December 2024, v. 349-350 |
| Page(s): | 118530 |
| DOI: | 10.1016/j.compstruct.2024.118530 |
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data sheet - Reference-ID
10796971 - Published on:
01/09/2024 - Last updated on:
01/09/2024
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