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Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM

Author(s):


Medium: journal article
Language(s): English
Published in: Energy and Buildings, , n. 8, v. 42
Page(s): 1259-1266
DOI: 10.1016/j.enbuild.2010.02.018
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.enbuild.2010.02.018.
  • About this
    data sheet
  • Reference-ID
    10465560
  • Published on:
    27/10/2020
  • Last updated on:
    27/10/2020
 
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