Flexure mechanism-based parallelism measurements for chip-on-glass bonding
| Author(s): |
Seung Won Jung
Won Soo Yun Songwan Jin Bo Sun Kim Young Hun Jeong |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Smart Materials and Structures, June 2011, n. 8, v. 20 |
| Page(s): | 085008 |
| DOI: | 10.1088/0964-1726/20/8/085008 |
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10224494 - Published on:
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02/12/2018
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